Wafer-Level Chip-Scale Packaging

Name: Wafer-Level Chip-Scale Packaging
Brand: Springer-Verlag New York Inc.
SKU: 9781493915552
Price: 155.22 EUR
Availability: InStock

Analog and Power Semiconductor Applications

Autor: Shichun Qu, Yong Liu

Jazyk:

Väzba: Pevná

Vydavateľ: Springer-Verlag New York Inc.

Dostupnosť: Skladom u dodávateľa

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155.22 €

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in a...

Informácie o knihe

Autor

Shichun Qu, Yong Liu

Jazyk

Angličtina

Väzba

Kniha - Pevná

Vydalo

2014

Stránok

322

EAN

9781493915552

ISBN

149391555X

Enbook ID

02780828

Vydavateľ

Springer-Verlag New York Inc.

Hmotnosť

6944

Rozmery

155 x 235 x 24

Kompletný popis

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

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Wafer-Level Chip-Scale Packaging

Analog and Power Semiconductor Applications

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Kompletný popis

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