Semiconductor Wafer Bonding - Science and Technology

Autor: Q.Y. Tong, Ulrich Gosele

Jazyk:

Väzba: Pevná

Vydavateľ: John Wiley & Sons Inc

Dostupnosť: Skladom u dodávateľa

Odosielame za 9-15 dní

175.50 €

A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and elect...

Informácie o knihe

Autor

Q.Y. Tong, Ulrich Gosele

Jazyk

Angličtina

Väzba

Kniha - Pevná

Vydalo

1998

Stránok

320

EAN

9780471574811

ISBN

0471574813

Enbook ID

04892270

Vydavateľ

John Wiley & Sons Inc

Hmotnosť

654

Rozmery

165 x 236 x 24

Kompletný popis

A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineers Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more. This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 published articles on wafer bonding. It covers all materials used for wafer bonding-including silicon, III-V compounds, fused and crystalline quartz, glass, silicon carbide, sapphire, ferroelectrics, and many others. For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering.

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Semiconductor Wafer Bonding - Science and Technology

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