Kniha Power Electronic Packaging Yong Liu

Power Electronic Packaging

Design, Assembly Process, Reliability and Modeling

Autor: Yong Liu
Jazyk: Angličtina
Väzba: Brožovaná
Dostupnosť: Skladom u dodávateľa
Odosielame za 5-8 dní
249.63
This in-depth view of varied aspects of power electronic packaging systematically introduces design,...

Informácie o knihe

Autor
Jazyk
Angličtina
Väzba
Kniha - Brožovaná
Vydalo
2014
Stránok
594
EAN
9781489987976
ISBN
1489987975
Enbook ID
06841507
Hmotnosť
926
Rozmery
155 x 235 x 33

Kompletný popis

This in-depth view of varied aspects of power electronic packaging systematically introduces design, assembly, reliability and failure analysis and materials selection, as well as covering the most advanced simulation and modeling techniques in the field.§

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