Kniha Introduction to Microsystem Packaging Technology Jing Chen

Introduction to Microsystem Packaging Technology

Autor: Jing Chen
Jazyk: Angličtina
Väzba: Pevná
Vydavateľ: Taylor & Francis Inc
Dostupnosť: 50 % šanca
Prehľadáme celý svet
250.42
Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced s...

Informácie o knihe

Autor
Jazyk
Angličtina
Väzba
Kniha - Pevná
Vydalo
2010
Stránok
232
EAN
9781439819104
ISBN
9781439819104
Enbook ID
06699473
Hmotnosť
574
Rozmery
253 x 180 x 19

Kompletný popis

Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.

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