Kniha High Performance Design Automation For Multi-chip Modules And Packages Paul D Franzon

High Performance Design Automation For Multi-chip Modules And Packages

Jazyk: Angličtina
Väzba: Pevná
Dostupnosť: 50 % šanca
Prehľadáme celý svet
95.68
Today's electronics industry requires new design automation methodologies that allow designers to in...

Informácie o knihe

Jazyk
Angličtina
Väzba
Kniha - Pevná
Vydalo
1996
Stránok
264
EAN
9789810223076
ISBN
9810223072
Enbook ID
05065166
Hmotnosť
359

Kompletný popis

Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages.

Mohlo by vás zaujímať

42.20
7.83

Jefferson

John B. Boles
37.21
23.01

Mime Musings

Charles Cozart
10.96
34.86
14.39

France/Norway

John Maxtone Graham
71.78

Othello

William Shakespeare
9.59
16.64

Double Take

Kevin Michael Connolly
10.96

Early Logging Tools

Kevin Johnson
21.24

Zákazníci, ktorí si kúpili túto knihu, kúpili tiež

Geglückt!

Marlene Kies
4.40

NANODENTYSTYKA

Ahsan Abdullah
52.58

Anima lunae

TRUEBA PEñUELAS
29.27

gestion del conocimiento tacito

Rubén Molina Martínez
42.40