Kniha Electronic Packaging for High Reliability, Low Cost Electronics Rao R. Tummala

Electronic Packaging for High Reliability, Low Cost Electronics

Jazyk: Angličtina
Väzba: Pevná
Vydavateľ: Springer
Dostupnosť: Skladom u dodávateľa
Odosielame za 10-13 dní
149.73
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New pac...

Informácie o knihe

Jazyk
Angličtina
Väzba
Kniha - Pevná
Vydalo
2000
Stránok
296
EAN
9780792352181
ISBN
0792352181
Enbook ID
01395791
Vydavateľ
Hmotnosť
1360
Rozmery
155 x 235 x 21

Kompletný popis

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

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