Designing TSVs for 3D Integrated Circuits

Name: Designing TSVs for 3D Integrated Circuits
Brand: Springer, Berlin
SKU: 9781461455073
Price: 50.13 EUR
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Autor: Nauman Khan, Soha Hassoun

Jazyk:

Väzba: Brožovaná

Vydavateľ: Springer, Berlin

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This book explores the challenges and presents best strategies for designing Through-Silicon Vias (T...

Informácie o knihe

Autor

Nauman Khan, Soha Hassoun

Jazyk

Angličtina

Väzba

Kniha - Brožovaná

Vydalo

2012

Stránok

EAN

9781461455073

ISBN

1461455073

Enbook ID

01428304

Vydavateľ

Springer, Berlin

Hmotnosť

179

Rozmery

155 x 235 x 10

Kompletný popis

This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a oorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.

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Designing TSVs for 3D Integrated Circuits

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