Kniha Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices SUHIR

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Autor: SUHIR
Jazyk: Angličtina
Väzba: Pevná
Vydavateľ: Taylor & Francis Ltd
Dostupnosť: Skladom u dodávateľa
Odosielame za 9-15 dní
217.92
The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlyi...

Informácie o knihe

Autor
Jazyk
Angličtina
Väzba
Kniha - Pevná
Vydalo
2021
Stránok
382
EAN
9781138624733
ISBN
113862473X
Enbook ID
32905881
Hmotnosť
754
Rozmery
241 x 167 x 31

Kompletný popis

The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

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