Menu
Zistiť stav objednávky
Kontaktujte nás
Kniha Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Seonho Seok

Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering

Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

Autor: Seonho Seok
Jazyk: Angličtina
Väzba: Brožovaná
Vydavateľ: Springer Nature Switzerland AG
Dostupnosť: Skladom u dodávateľa
Odosielame za 5-8 dní
139.31 €
This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin film...

Informácie o knihe

Autor
Seonho Seok
Jazyk
Angličtina
Väzba
Kniha - Brožovaná
Vydalo
2019
Stránok
115
EAN
9783030085612
ISBN
3030085619
Enbook ID
21349346
Vydavateľ
Springer Nature Switzerland AG
Hmotnosť
203
Rozmery
155 x 235 x 8

Kompletný popis

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

Mohlo by vás zaujímať

Microfinance, Financial Innovation, and Sustainable Entrepreneurship in Economics

Lawrence C Bellamy
205.75 €

Double End Bag Workout

Sammy Franco
12.12 €

It Don't Mean a Thing for Clarinet Quartet

Giordano Muolo
16.13 €

Fighting the People's War

Jonathan Fennell
24.25 €

Differential Information Economies

Dionysius Glycopantis
199.00 €

Math Review Handbook: Common Core Standards

Henry Gu
10.26 €

Plot Genie: Comedy

Wycliffe a Hill
17.70 €

Inside Their Minds: Australian Criminals

Rochelle Jackson
20.24 €

OLD FAITHS IN NEW LIGHT

NEWMAN SMYTH
33.45 €

Brendan Behan

E.H. Mikhail
48.91 €

Sacred Motherhood

Anni Daulter
15.94 €

Zákazníci, ktorí si kúpili túto knihu, kúpili tiež

Interpretaciya muzyki

Valerij Hramov
22.49 €

Zur Religiosen Lage, Religionsphilosophie Und Ethik V2 (1913)

Ernst Troeltsch
34.33 €

TERRAIN, N 3/OCT. 1984. ETHNOLOGIE URBAINE

11.54 €

Protocolos de vigilancia sanitaria

ESPAÑA. MINISTERIO DE SANIDAD Y CONSUMO
6.15 €

150 giochi semantico-lessicali. Sviluppare i prerequisiti linguistici e trasversali per l'apprendimento

Donatella Colina
25.33 €

365 Rund-ums-Jahr-Bastelideen

Susanne Pypke
20.44 €

BABADADA black-and-white, Qhichwa - Cymraeg, simipirwa siq'iyuq - geiriadur lluniau

7.62 €

The Gray Man - Undercover in Syrien

Robert Schekulin
13.98 €